MEZZANINE STRIPS |
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Q Strip® High Speed Interconnects |
Specifications
- Pitch:
- .5mm (.0197”)
- .635mm (.025”)
- .8mm (.0315”)
- Stack Height: 5-30mm
- Contacts: Up to 240 I/Os
- Performance: Up to 9.0 GHz / 18 Gbps
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Series
- QSH – .5mm Socket
- QTH – .5mm Terminal
- QSS – .635mm Socket
- QTS – .635mm Terminal
- QSE – .8mm Socket
- QTE – .8mm Terminal
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Features
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and horizontal applications
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Additional Links
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Q Pairs® Differential Pair Interconnects |
Specifications
- Pitch:
- .5mm (.0197”)
- .635mm (.025”)
- .8mm (.0315”)
- Stack Height: 5-30mm
- Contacts: Up to 80 pairs
- Performance: Up to 8.5 GHz / 17 Gbps
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Series
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Features
- Optimized for 100Ω systems
- Integral ground/power plane
- Vertical, perpendicular, and horizontal applications
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Additional Links
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Q Rate™ Slim, Rugged High Speed Interconnects |
Specifications
- Pitch: .8mm (.0315”)
- Stack Height: 7mm and 10mm
- Contacts: Up to 156 I/Os
- Performance:
7mm Stack Height 9.5 GHz, 19 Gbps Single-ended 8.5 GHz, 17 Gbps Differential Pair
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Series
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Features
- Rugged Edge Rate™ contacts
- Integral ground/power plane
- Slim Footprint (less than 5mm wide)
- Optimized signal integrity
- High cycle life
- “Zippered” mating/unmating
- 1,39mm contact wipe insertion depth
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Additional Links
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Q2™ Rugged/High Speed Interconnects |
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Specifications
- Pitch: .635mm (.025”)
- Stack Height: 10-16mm
- Contacts: Up to 208 I/Os
- Performance: Up to 8.0 GHz / 16 Gbps
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Series
- QFS – .635mm Socket
- QMS – .635mm Terminal
- QFS-DP – .635mm Differential Pair Socket
- QMS-DP – .635mm Differential Pair Terminal
- QFSS – .635mm Shielded Socket
- QMSS – .635mm Shielded Terminal
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Features
- Optional EMI shielding
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Retention pins available
- Power and RF end options
- 15,24mm stacking version meets PCIE specifications
- Vertical, perpendicular, and horizontal applications
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Additional Links
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Edge Rate™ Rugged, High Speed Interconnects |
Specifications
- Pitch: .8mm (.0315”)
- Stack Height: 7-16mm
- Contacts: Up to 150 I/Os
- Performance: Up to 10.5 GHz / 21 Gbps
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Series
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Features
- Rugged Edge Rate™ contacts
- Contact designed for high speed applications
- Smooth, milled, mating surface
- High cycle life
- Optional latching
- Reduces broadside coupling
- “Zippered” mating/unmating
- Vertical, perpendicular, and horizontal applications
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Additional Links
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Specifications
- Pitch: .5mm (.0197”)
- Stack Height: .276" or .394"
- Contacts: 10, 20, 30, 40, 50 pins per row
- Performance: 1.8 amps at 85°C
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Series
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Features
- Surface mount
- Available on 10, 20, 30, 40 and 50 Positions Per Row
- Double Row
- Selective Gold Plating
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Additional Links
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Razor Beam™Slim, Fine Pitch, Interconnects |
Hermaphroditic Interconnects |
Specifications
- Pitch:
o .635mm (.025”) o .5mm (.0197”)
- Stack Height: 6-12mm
- Contacts: Up to 100 I/Os
- Performance: Up to 10.0 GHz / 20 Gbps
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Series
- LSS – .635mm Hermaphroditic Connector
- LSHM – .5mm Hermaphroditic Connector
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Features
- Fine pitch
- Slim footprint
- Rugged
- Undercut retention notches
- Audible click when connectors are fully mated
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Additional Links
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