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首页 ꄲ 连接器及线缆组件 ꄲ HIGH DENSITY ARRAYS

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HIGH DENSITY ARRAYS

SEARAY™;LP Array;HD Mezz* Open Pin Field Array ;DP Array™ (Differential Pair Array) ;Z Beam® One Piece Interface .

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HIGH DENSITY ARRAYS
SEARAY™
Specifications Pitch: .050” (1,27mm) & .8mm (.0315") Stack Height: 7-17,5mm Contacts: Up to 500 I/Os Performance: Up to 9.5 GHz / 19 Gbps	Series SEAF – .050" Socket SEAM – .050" Terminal SEAF-RA – .050" Right Angle Socket SEAM-RA - .050" Right Angle Terminal SEAM8 - .8mm Terminal SEAF8 - .8mm Socket SEAMP - .050" Press Fit Terminal
Features Maximum routing and grounding flexibility Lower insertion/extraction forces vs typical array products Numerous row options: Slim 4 row – 10 row “Zippered” mating/unmating Unique solder charge technology Fixturing required to process right angle eight and ten row options	Additional Links Performance Data - Single-Ended Performance Data - Differential Pair Final Inch® eBrochure PCI Express Pismo2 Vita57 Maximum Pair Count Data Processing Recommendations Media Room Contact us
LP Array
Specifications Pitch: .050” (1,27mm) Stack Height: 4 - 5mm Contacts: Up to 180 I/Os	Series LPAM – .050" Terminal LPAF – .050" Socket
Features Low Profile Open pin field design Unique solder charge technology	Additional Links Contact us
HD Mezz* Open Pin Field Array
Specifications Pitch: 1,20mm (.0472”) Stack Height: 20-35mm Contacts: 299, 195, or 143 I/Os Performance: Up to 9.5 GHz / 19 Gbps	Series HDAF – 1,20mm Socket HDAM – 1,20mm Terminal
Features Open pin field design Better performance at taller stack heights Intermateable with Molex Inc HD Mezz* *HD Mezz is a Molex product that is intermatable with Samtec’s HD Mezz system. HD Mezz is a trademark of Molex Incorporated.	Additional Links Performance Data - Single-Ended Performance Data - Differential Pair Final Inch® eBrochure Contact us
DP Array™ (Differential Pair Array)
Specifications Pitch: 2,16mm (.0850”) Stack Height: 10mm, 14mm, 17mm Contacts: Up to 100 I/Os Performance: Up to 7.0 GHz / 14 Gbps Series	Series DPAF – 2,16mm Socket DPAM – 2,16mm Terminal
Features Staggered pin layout reduces grounds Up to 168 usable pairs No return paths needed Perimeter grounds simplify routing Unique solder crimp on tails	Additional Links Performance Data - Differential Pair Final Inch® eBrochure PCI Express Contact us
Z Beam® One Piece Interface
Specifications Pitch: .050” (1,27mm) Contacts: Up to 900 I/Os Stack Height: 1,65mm & 3mm Series	Series GFZ – .050” (1,27mm) One Piece Interface
Features Solderless connection with compression tail Low Profile Easy to replace: Allows field upgrade/exchange Minimizes coefficient and thermal expansion issues	Additional Links Contact us