| MICRO BACKPLANE SYSTEMS |
|
| SEARAY™ High Speed, High Density Arrays |
Specifications
- Pitch: .050” (1,27mm)
- Contacts: Up to 300 I/Os
- Performance: Up to 9.5 GHz / 19 Gbps
|
Series
- SEAM – .050” (1,27mm) Terminal
- SEAF - .050” (1,27mm) Socket
- SEAF-RA – .050” (1,27mm) Right Angle Socket
|

 |
Features
- Maximum routing and grounding flexibility
- Lower insertion/extraction forces vs typical array products
- 4 row and 6 row options
- “Zippered” mating/unmating
- Unique solder charge technology
|
Additional Links
|
| High Speed Edge Card |
Specifications
- Pitch: .8mm (.0315”)
- Contacts: Up to 200 I/Os
- Performance: Up to 10.5 GHz / 21 Gbps
- Card Slot: 1,60mm (.063”)
|
Series
- HSEC8-DV – .8mm High Speed Edge Card
- HSEC8-EM – .8mm High Speed Edge Card (Edge Mount)
|
 |
Features
- Optional board locks
- Single ended and differential pair signaling
|
Additional Links
|
| Edge Rate™ Rugged, High Speed Interconnects |
Specifications
- Pitch: .8mm (.0315”)
- Contacts: Up to 100 I/Os
- Performance: Up to 10.5 GHz / 21 Gbps
|
Series
|

 |
Features
- Rugged Edge Rate™ contacts
- Contact designed for high speed applications
- Smooth, milled, mating surface
- High cycle life
- Reduces broadside coupling
- “Zippered” mating/unmating
|
Additional Links
|
Specifications
- Pitch: .5mm (.0197”)
- Stack Height:
- Contacts:
- Performance:
|
Series
|

 |
Features
- Surface mount
- Available on 10, 20, 30, 40 and 50 Positions Per Row
- Double Row
- Selective Gold Plating
|
Additional Links
|
| Q2® Rugged/High Speed Interconnects |
Specifications
- Pitch: .635mm (.025”)
- Contacts: Up to 208 I/Os
- Performance: Up to 8.0 GHz / 16 Gbps
|
Series
- QFS –.635mm Socket
- QMS - .635mm Terminal
- QFSS - .635mm Shielded Socket
- QMSS - .635mm Shielded Terminal
- QFS-RA – .635mm Right Angle Socket
- QMS-RA – .635mm Right Angle Terminal
- QFS-EM – .635mm Edge Mount Socket
- QMS-EM – .635mm Edge Mount Terminal
- QFSS-EM - .635mm Shielded Edge Mount Socket
- QMSS-EM - .635mm Shielded Edge Mount Terminal
|

 |
Features
- Increased insertion depth
- Dual stage hot pluggable
- Integral ground/power plane
- Shielded option available
- Edge mount option available
- Power and RF ends options
- Differential Pair Available
|
Additional Links
|
| Q Strip® High Speed Interconnects |
Specifications
- Pitch: .635mm (.025”)
- Contacts: Up to 200 I/Os
- Performance: Up to 9.0 GHz / 18 Gbps
|
Series
- QTS - .635mm Terminal
- QSS – .635mm Socket
- QTS-RA – .635mm Right Angle Terminal
- QSS-RA - .635mm RIght Angle Socket
|

 |
Features
- Integral ground/power plane
- Connector to connector retention options
- Vertical, perpendicular, and horizontal applications
|
|
| Micro TCA Connectors
|
Specifications
- Pitch: .75mm (.030”)
- Contacts: Up to 170 I/Os
- Card Slot: 1,60mm (.063”)
|
Series
- MTCA – Micro TCA Connector
|
 |
Features
- Compliant to μTCA™ standard architecture
- Form/fit/function compatibility with Molex Press fit tails
- Supports hot plugging and high speed serial connections
|
Additional Links
|
| Dual Stack Edge Card (In Design) |
Specifications
- Pitch: .8mm (.0315”)
- Contacts: Up to 100 per card slot
- Performance: Testing in progress
- Card Slot: 1,60mm (.063”)
|
Series
- DSEC – Right Angle Dual Stack Edge Card Socket
|
 |
Features
- Dual stacked card slots
- Right angle orientation
- Edge Rate™ contacts
|
Additional Links
|
| Bi-Level Edge Card (In Design) |
Specifications
- Pitch: .5mm (2 levels 0f 1mm staggered)
- Contacts: Up to 140 I/Os
- Performance: Testing in progress
- Card Slot: 1,60mm (.062”) & 2,36mm (.093”)
|
Series
- BEC5 – .8mm High Speed Edge Card (Edge Mount)
|
 |
Features
- 2 mating stages (bi-level mating)
- 4 rows of contacts
- High speed Edge Rate™ contacts
- Saves PCB real estate
|
Additional Links
|