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MICRO RUGGED SYSTEMS

Rugged Tiger Eye™ Systems;Edge Rate™ Rugged, High Speed Interconnects ;Q Rate™ Slim, Rugged, High Speed Interconnects ;Q2® Rugged/High Speed Interconnects ;Hermaphroditic Systems ;Fine Pitch Interconnects ;
MICRO RUGGED SYSTEMS
Rugged Tiger Eye™ Systems
Specifications
  • Pitch:
    o  .8mm (.0315”)
    o   .050” (1,27mm)
    o  2mm (.0787”)
  • Stack Heights:  5,97mm (.235") - 11,81mm (.465")
  • Contacts: Up to 100 I/Os
  • Performance:  Up to 17.5 GHz/35 Gbps
Series
  • SEM – .8mm Socket
  • TEM – .8mm Terminal
  • SFM – .050” Socket
  • TFM – .050” Terminal
  • SFC – .050” Cost Saving Socket
  • TFC – .050” Cost Saving Terminal
  • SMM – 2mm Socket
  • TMM – 2mm Terminal

*Click on series to view Tech Specs and mating connectors



 
Features
  • High reliability, Tiger Eye™, three-finger contact
  • Standard and cost saving designs
  • Optional friction latch system
  • Vertical and right angle orientations
  • Shrouded, polarized, and keyed
  • Alignment pin, locking clip, and weld tab options
  • Choice of mated heights
  • Rugged latching system
Additional Links
Edge Rate™ Rugged, High Speed Interconnects
Specifications
  • Pitch: .8mm (.0315”)
  • Stack Height: 7-16mm
  • Contacts: Up to 100 I/Os
  • Performance: Up to 10.5 GHz / 21 Gbps
Series
  • ERF8 – .8mm Socket
  • ERM8 - .8mm Terminal

 
Features
  • Rugged Edge Rate™ contacts
  • Contact designed for high speed applications
  • Smooth, milled, mating surface
  • High cycle life
  • Reduces broadside coupling
  • “Zippered” mating/unmating
Additional Links
Q Rate™ Slim, Rugged, High Speed Interconnects
Specifications
  • Pitch: .8mm (.0315”)
  • Stack Height: 7mm and 10mm
  • Contacts: Up to 156 I/Os
  • Performance: Testing in progress
Series
  • QRF8 – .8mm Socket
  • QRM8 - .8mm Terminal


 
Features
  • Rugged Edge Rate™ contacts
  • Integral ground/power plane
  • Slim Footprint (less than 5mm)
  • Optimized signal integrity
  • High cycle life
  • “Zippered” mating/unmating
  • 1,39mm contact wipe insertion depth
Additional Links
Q2® Rugged/High Speed Interconnects
Specifications
  • Pitch: .635mm (.025”)
  • Stack Height: 10-16mm
  • Contacts: Up to 208 I/Os
  • Performance: Up to 8.0 GHz / 16 Gbps
Series
  • QFS –.635mm Socket
  • QMS - .635mm Terminal
  • QFS-DP – .635mm Differential Pair Socket
  • QMS-DP – .635mm Differential Pair terminal
  • QFSS – .635mm Shielded Socket
  • QMSS – .635mm Shielded Terminal

*Click on series to view Tech Specs and mating connectors

 
Features
  • Optional EMI shielding
  • Increased insertion depth
  • Dual stage hot pluggable
  • Integral ground/power plane
  • Edge mount option available
  • Power and RF end options
  • Up to 208 I/Os
  • Vertical, perpendicular, and horizontal applications
Additional Links
Hermaphroditic Systems
Specifications
  • Pitch: .5mm (.0197”) .635mm (.025”)
  • Stack Height: 6-12mm
  • Contacts: Up to 80 I/Os
  • Performance:
    • LSS - Up to 10.0 GHz / 20 Gbps
    • LSHM - Up to 11.5 GHz / 23 Gbps
Series
  • LSS – .635mm Hermaphroditic Connector
  • LSHM – .5mm Hermaphroditic Connector

 
Features
  • Fine pitch
  • Slim footprint
  • Rugged Undercut retention notches
  • Optional friction locks
  • Parallel, perpendicular, and coplanar applications
Additional Links
 Fine Pitch Interconnects
Socket/Terminal System
Specifications
  • Pitch: .4mm (.016”)
  • Stack Height: 4-6mm
  • Contacts: Up to 100 I/Os
  • Performance: Up to 7.0 GHz / 14 Gbps
Series
  • SS4 - .4mm Socket
  • ST4 - .4mm Terminal

 
Features
  • Ultra-fine pitch
  • Low profile
  • Slim
  • Optional latching
Additional Links