3M™ Textool ™ Test & Burn-In Sockets
Textool™ Ball Grid Array (BGA) Sockets, Open Top
0.65 mm pitch Sockets, Types I, II, III
0.80 mm pitch Sockets, Types I, II, III and IV
1.00 mm pitch Sockets, Types 0, I, II, III Open Top
1.27 mm pitch Sockets, Types II, III
Textool™ Dual In-Line Packaging (DIP) Sockets
.070" Shrink, pin count (28 to 90 leads)
.100" (2.54 mm) Universal
.100" (2.54 mm) ZIP, pin count (14 to 64 leads)
Receptacles for DIP Sockets
Textool™ Pin Grid Array (PGA) Sockets
IPGA, 17x17 outer matrix, holds 432 leads
IPGA, 19x19 outer matrix, holds 685 leads
PGA Kit Socket, 10x10 to 25x25 matrices
SPGA, max grid 37x37, lead count of 600
ZIP Socket, 10x10 through 25x25 matrices
Textool™ Strip (ZIP) Sockets
.050" (1.27 mm) x .100" (2.54 mm), w/ top-plate requires vertical insertion of leads
.050" (1.27 mm) x .100" (2.54 mm), w/o top-plate enables horizontal insertion of leads
.100” [2.54 mm] In-Line ZIP Strip Sockets
1.00 mm pitch Sockets, Type I, II, III
Textool™ Discrete Sockets
Compact miniature socket size, 3 and 4 lead options available
Entry ports accept devices with .075" (1.90 mm) to .200" (5.1 mm) between leads
Textool™ Leadless Chip Carrier (LCC) Sockets
OEM Sockets (32, 68 & 84 Leads)
Textool™ SOIC Sockets
Compact envelope w/ tweezer slot for easy loading
