首页
ꄲ
3M™ Adhesive for Temporary Bonding
Adhesive-for-Temporary-Bonding_thumb2
넳
넲
3M™ Adhesive for Temporary Bonding
| Product |
Applications/Notes |
| 3M™ UV-Curable Adhesive LC-3200 |
3M™ Liquid UV-Curable Adhesive LC-3200 is a 100% solids UV curable acrylic adhesive. Adhesive LC-3200 is suitable for mounting silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System. |
| 3M™ Liquid UV-Curable Adhesive LC-4200 |
3M™ Liquid UV-Curable Adhesive LC-4200 is a 100% solids UV curable acrylic adhesive. Adhesive LC-4200 is suitable for mounting silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System. Adhesive LC-4200 has been designed to allow for post processing of mounted wafers at temperatures up to 180°C for extended periods as well as short excursions to 200°C. |
| 3M™ Light-To-Heat-Conversion (LTHC) Coating |
3M™ Light-To-Heat-Conversion (LTHC) Release Coating is a solvent-based coating. This coating forms the light to heat conversion layer on glass using the substrate for 3M™ Wafer Support System by spin coating method. |
| 3M™ Wafer De-Taping Tape 3305 |
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape. |