3M™ 导热垫片（硅酮弹性体）
注意：*5591S、 5592S、5595S．5516S，5519S是5591、 5592、 5595、 5516、 5519等带-层聚合物薄膜的版本，拥有一个无粘表面，利于返工，导热性能有轻微变化，但是绝缘性能会增加。 **3M导热垫片标准厚度0.5mm-2.Omm 可根据客户需求供更厚表面定制不同厚度产品。 ***持续工作温度取决于客户最终的设计和环境条件，3M建议的温度菠围是基于UL-746和3M的测试方法。 ****仅厚度=<l.Omm的5516S的防火等级为V1．其余均为v0。
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| 3M™ Thermally Conductive Silicone Interface Pad 5514 | Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders and other cooling devices. Consists of a conformable silicone elastomer sheet filled with thermally conductive ceramic fillers. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5515 | 3M Thermally Conductive Silicone Interface Pads 5515-20 and 5515-25 are designed to provide a preferential heat transfer path between heat generating components and cooling device for thin thickness.(0.2-0.25 mm) requirement. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5515S | Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders and other cooling devices. Consists of a conformable silicone elastomer sheet filled with thermally conductive ceramic fillers. The 5515S also includes a polyimide film layer for higher dielectric strength, abrasion resistance and improved handling. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5516 | Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. Consists of highly conformable, slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5516S | Same as 3M Pad 5516 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5519 | Designed to provide heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. Consists of highly conformable, slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5519S | Same as 3M Pad 5519 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5591S | Polyester film supported super soft, silicone elastomer with thermal conductivity of 1.0 W/mk. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties. Handles easily without crumbling. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5592 | Soft, silicone elastomer with thermal conductivity of 1.1 W/mk. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties. Handles easily without crumbling. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5592S | Same as 3M Pad 5592 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5595 | Soft, silicone elastomer with thermal conductivity of 1.6 W/mk. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties. Handles easily without crumbling. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 3M™ Thermally Conductive Silicone Interface Pad 5595S | Same as 3M Pad 5595 but with a polymeric permanent film on one side to be used as a non-tacky surface for ease of reworking an assembly. Thermal Conductivity and Impedance slightly changes with addition of the film. Dielectric strength is improved. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
