PHASE-CHANGE THERMAL INTERFACE MATERIALS

THERMFLOW T557 & T558 MULTIPHASE Thermal Interface Material
THERMFLOW T557 MULTIPHASE thermal interface pads are phase-change materials specially formulated for use in high performance devices requiring minimum thermal resistance for maximum thermal performance and component reliability. T557 provides the high performance of typical phase change materials with the added benefit of improved thermal stability over conventional phase change pads. T557 is a 0.005 inch (0.13mm) thick, inherently adhesive film that softens at device operating temperatures resulting in grease-like performance.

THERMFLOW T558 is recommended for applications where rework and ease of disassembly are important. This new material provides the high performance properties typical of free-film phase change materials with the added benefit of easy removal. T558 is the same phase material as T557 which has been coated on one side of a conformal metal foil carrier. It is easily attached onto a heat sink or heat spreader, leaving the metal foil surface exposed. This foil eliminates the need of a protective liner, which simplifies the final assembly process and minimizes shipping concerns and contamination issues.

THERMFLOW® T766 High Performance, Reworkable Phase Change Material
THERMFLOW T766 phase change thermal interface material is recommended for applications where rework and ease of disassembly are important. The material provides the high performance properties of typical phase change materials with the added benefit of easy removal. It consists of a tacky, electrically non-conductive phase change film on one side of a conformable metal foil carrier. T766 can be assembled onto a heat sink or heat spreader, leaving the metal foil exposed. The natural tack of the phase change polymer will hold the T766 to the heat sink, while the foil layer acts as a clean interface between the component and heat sink, allowing a clean break during disassembly or rework. The foil also eliminates the need for a protective liner, which simplifies the final assembly process and minimizes shipping concerns and contamination issues.

THERMFLOW T725 Phase-Change Material
THERMFLOW T725 phase-change thermal interface material combines the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules. For high power microprocessors(>50 watt dissipation), DC/DC converters, IGBTs and other power modules - Recommended for pressure range of 5 to 50 psi.

THERMFLOW T710 Phase-Change Material
THERMFLOW T710 phase-change thermal interface material combines the consistency and ease of use of elastomeric pads with the low thermal impedance of thermal grease. This low thermal resistance path maximizes heat sink performance and improves the reliability of microprocessors, memory modules, DC/DC converters and power modules. For microprocessors and power ICs, which are typically attached to heat, sinks with spring clips - Recommended for pressure range of 5 to 50 psi. PSA versions allow peel and stick installation.